Chemical vapor deposition (CVD) is a technique to coat substrates with thin films. The coating is hereby deposited out of the gas phase by chemical reactions.
The substrate is heated while a gas is streaming over its surface. Due to the temperature a chemical reaction of the gas molecules takes place at the surface. With the time more and more molecules are adsorbed forming a coating.
CVD can be performed in various conditions (under atmospheric pressure, in vacuum etc.).
Instead of temperature the reaction energy is supplied by plasma. A Plasma contains ions that can be accelerated electrically electricallyonto the substrate. The advantages compared to the classical CVD are:
Plasma Electronic offers the following PECVD coatings:
We develop all PECVD processes according to your special needs. Contact us!
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