Chemical Vapor Deposition (CVD)

Chemical vapor deposition (CVD) is a technique to coat substrates with thin films. The coating is hereby deposited out of the gas phase by chemical reactions.

Functional principle

Classical CVD

The substrate is heated while a gas is streaming over its surface. Due to the temperature a chemical reaction of the gas molecules takes place at the surface. With the time more and more molecules are adsorbed forming a coating.

CVD can be performed in various conditions (under atmospheric pressure, in vacuum etc.).

Events in a CVD; image source
Scheme of the CVD of DLC
Scheme of the CVD of DLC

Plasma-enhanced CVD (PECVD)

Instead of temperature the reaction energy is supplied by plasma. A Plasma contains ions that can be accelerated electrically electricallyonto the substrate. The advantages compared to the classical CVD are:

  • The process temperature is low enough to coat also temperature-sensitive plastics
  • Higher deposition rates are possible
  • The ions can be accelerated so strong that they form a hard coating. For example in a hydrocarbon plasma a diamond-like carbon (DLC) coating can be deposited.
  • On plastics the coatings are chemically bound to the surface. They therefore show the optimal adhesion.

Plasma Electronic offers the following PECVD coatings:

We develop all PECVD processes according to your special needs. Contact us!

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